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CVE-2023-33059VulnerabilityPublished Updated

CVE-2023-33059: Qualcomm Snapdragon · Integer Underflow (Wrap or Wraparound)

Affects Qualcomm SnapdragonSource CVE Database V5

0

Not known to be exploited · CVSS 7.8 High.

Data as of 25 Oct 2026, 19:02 UTC

CVSS 3.1 base score
7.8High
How severe the flaw is on the 0–10 CVSS scale.
EPSS
0.1% chance of exploitation in 30 days – higher than 1% of CVEsExploit Prediction Scoring System: the likelihood attackers will use this flaw soon.
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Exploitation evidence

  1. Disclosed: evidence found.

    CVE published 7 Nov 2023

  2. Detectable: no evidence on record.

    No public nuclei template indexed

  3. Weaponised: no evidence on record.

    No public exploit code indexed in Metasploit or Exploit-DB

  4. Exploited in the wild: no evidence on record.

    Not in CISA KEV and no source reports exploitation

  5. Observed by OffSeq Mirage: no evidence on record.

    No attack traffic recorded by OffSeq Mirage sensors

A missing step is not evidence of safety. Sources: cve.org (opens in a new tab), the Metasploit, Exploit-DB and nuclei-templates index as of 2026-10-25.

What to do

AI-suggested

Mitigation should focus on coordinated efforts between device manufacturers, service providers, and end-users. Qualcomm and OEMs must prioritize releasing firmware and software patches that address the integer underflow by implementing robust input validation and safe arithmetic operations in the audio processing code. European organizations should inventory devices using affected Snapdragon platforms and apply updates as soon as patches become available. Where patching is delayed, organizations should restrict local access to vulnerable devices, enforce strict privilege separation, and monitor for anomalous audio subsystem behavior or memory corruption indicators. Employing endpoint detection and response (EDR) solutions capable of detecting exploitation attempts targeting audio processing components can enhance defense. For IoT and automotive deployments, network segmentation and strict access controls can limit attacker movement. Security teams should also engage with vendors to confirm patch status and validate remediation. Finally, raising user awareness about the risks of local privilege escalation and enforcing device hardening policies will reduce exploitation likelihood.

Description

CVE-2023-33059 is a high-severity integer underflow vulnerability (CWE-191) affecting a wide range of Qualcomm Snapdragon platforms and related chipsets. The flaw occurs due to improper handling of VOC packet data in the audio processing component of the ADSP, leading to memory corruption. Exploitation requires local privileges and no user interaction, potentially allowing attackers to compromise confidentiality, integrity, and availability of affected devices. This vulnerability impacts numerous Snapdragon-based devices, including mobile phones, IoT devices, automotive platforms, and wearable technology. Although no known exploits are currently reported in the wild, the broad range of affected products and the high CVSS score (7.8) indicate significant risk. European organizations relying on Snapdragon-powered devices, especially in telecommunications, automotive, and industrial IoT sectors, may face operational and security risks. Mitigation requires timely patching from device manufacturers and applying strict input validation and memory safety checks in audio processing modules. Countries with high adoption of Snapdragon devices and advanced automotive or IoT industries, such as Germany, France, the UK, and the Nordics, are most likely to be affected. Due to the complexity and privilege requirements, exploitation is moderately difficult but impactful, warranting urgent attention from defenders.

References

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