CVE-2025-27067 is a high-severity vulnerability identified in Qualcomm Snapdragon components, specifically affecting several FastConnect and WCD/WSA series chipsets (FastConnect 6900, 7800; SC8380XP; WCD9380, 9385; WSA8840, 8845, 8845H). The root cause is an improper validation of array index (CWE-129) during the processing of a DDI (Device Driver Interface) call with an invalid buffer. This improper validation leads to memory corruption, which can compromise the confidentiality, integrity, and availability of the affected device. The vulnerability has a CVSS v3.1 score of 7.8, indicating high severity, with attack vector local (AV:L), low attack complexity (AC:L), requiring low privileges (PR:L), no user interaction (UI:N), unchanged scope (S:U), and high impact on confidentiality, integrity, and availability (C:H/I:H/A:H). The flaw allows an attacker with local access and low privileges to exploit the vulnerability without user interaction, potentially leading to arbitrary code execution, privilege escalation, or system crashes. The affected Snapdragon components are widely used in mobile devices, IoT, and embedded systems, making this vulnerability particularly relevant for devices relying on these chipsets for wireless connectivity and processing. No known exploits are currently reported in the wild, and no patches have been linked yet, indicating the need for proactive mitigation and monitoring. The vulnerability's nature suggests that attackers could craft malicious inputs to the DDI interface to trigger out-of-bounds memory access, causing memory corruption and enabling further exploitation.

For European organizations, the impact of CVE-2025-27067 is significant due to the widespread use of Qualcomm Snapdragon chipsets in smartphones, tablets, and IoT devices commonly deployed in enterprise environments. Compromise of these devices could lead to unauthorized access to sensitive corporate data, disruption of communication channels, and potential lateral movement within networks. Industries such as telecommunications, finance, healthcare, and critical infrastructure that rely heavily on mobile and embedded devices are particularly at risk. The high confidentiality, integrity, and availability impact means that data breaches, service outages, and device takeovers could occur, affecting business continuity and regulatory compliance (e.g., GDPR). Additionally, the local attack vector implies that attackers need some level of access to the device, which could be achieved through physical access, compromised apps, or insider threats. Given the lack of patches, organizations must be vigilant in monitoring device behavior and network traffic to detect potential exploitation attempts.

To mitigate CVE-2025-27067, European organizations should: 1) Inventory and identify all devices using the affected Qualcomm Snapdragon chipsets, focusing on FastConnect 6900/7800 and WCD/WSA series. 2) Apply any available firmware or software updates from device manufacturers or Qualcomm as soon as they are released. 3) Restrict local access to devices by enforcing strong physical security controls and limiting administrative privileges. 4) Employ mobile device management (MDM) solutions to monitor device integrity and detect anomalous behavior indicative of exploitation attempts. 5) Harden the device environment by disabling unnecessary services and interfaces that could be used to invoke the vulnerable DDI calls. 6) Educate users about the risks of installing untrusted applications that might exploit local vulnerabilities. 7) Implement network segmentation to isolate critical devices and reduce the attack surface. 8) Monitor security advisories from Qualcomm and related vendors for patches or exploit reports. 9) Consider deploying endpoint detection and response (EDR) tools capable of identifying memory corruption or unusual process behavior on affected devices.