CVE-2025-27071: CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow') in Qualcomm, Inc. Snapdragon
Memory corruption while processing specific files in Powerline Communication Firmware.
AI Analysis
Technical Summary
CVE-2025-27071 is a high-severity buffer overflow vulnerability (CWE-120) found in Qualcomm Snapdragon products, specifically within the Powerline Communication Firmware. This vulnerability arises due to improper handling of input sizes during buffer copy operations, leading to memory corruption when processing specially crafted files. The affected products include a wide range of Snapdragon platforms and associated modem and wireless components such as FastConnect 6800/6900/7800, Snapdragon 8 Gen 1, Snapdragon 865/865+/870 5G Mobile Platforms, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon XR2 5G Platform, and various wireless connectivity chips (WCD, WCN, WSA series). The CVSS v3.1 base score is 7.3, indicating a high severity level with network attack vector, low attack complexity, no privileges required, and no user interaction needed. The impact includes potential confidentiality, integrity, and availability compromises due to memory corruption, which could be exploited remotely without authentication. Although no known exploits are currently reported in the wild, the vulnerability’s nature and broad product impact make it a significant risk. Qualcomm has not yet published patches for this vulnerability as of the provided data. Organizations relying on affected Snapdragon components in their devices or infrastructure should prioritize risk assessment and mitigation strategies.
Potential Impact
For European organizations, the impact of CVE-2025-27071 is substantial due to the widespread use of Qualcomm Snapdragon chipsets in mobile devices, IoT devices, wearables, and networking equipment. Exploitation could lead to remote code execution, data leakage, or denial of service, affecting confidentiality, integrity, and availability of critical systems. Enterprises with mobile workforces using affected smartphones or tablets may face data breaches or device compromise. Industrial sectors utilizing IoT devices with these chipsets for automation or communication could experience operational disruptions. The vulnerability’s exploitation without user interaction and privileges increases the risk of large-scale attacks, potentially impacting sensitive government, financial, healthcare, and critical infrastructure sectors across Europe. Additionally, the lack of patches heightens exposure until mitigations or updates are available.
Mitigation Recommendations
1. Immediate inventory and identification of devices and equipment using affected Qualcomm Snapdragon components across the organization’s environment. 2. Engage with device manufacturers and Qualcomm for timelines on patches or firmware updates and apply them promptly once available. 3. Implement network-level protections such as intrusion detection/prevention systems (IDS/IPS) tuned to detect anomalous traffic patterns or malformed packets targeting Powerline Communication Firmware interfaces. 4. Employ strict network segmentation to isolate vulnerable IoT and mobile devices from critical infrastructure and sensitive data stores. 5. Enforce endpoint security controls including application whitelisting, behavior monitoring, and anomaly detection to identify potential exploitation attempts. 6. Educate users about the risks and encourage minimizing exposure by avoiding untrusted networks or files that could trigger the vulnerability. 7. Monitor threat intelligence feeds for emerging exploit techniques or proof-of-concept code to adapt defenses proactively. 8. Consider deploying virtual patching or compensating controls at the network edge until official patches are released.
Affected Countries
Germany, France, United Kingdom, Italy, Spain, Netherlands, Sweden, Finland, Poland, Belgium
CVE-2025-27071: CWE-120 Buffer Copy Without Checking Size of Input ('Classic Buffer Overflow') in Qualcomm, Inc. Snapdragon
Description
Memory corruption while processing specific files in Powerline Communication Firmware.
AI-Powered Analysis
Technical Analysis
CVE-2025-27071 is a high-severity buffer overflow vulnerability (CWE-120) found in Qualcomm Snapdragon products, specifically within the Powerline Communication Firmware. This vulnerability arises due to improper handling of input sizes during buffer copy operations, leading to memory corruption when processing specially crafted files. The affected products include a wide range of Snapdragon platforms and associated modem and wireless components such as FastConnect 6800/6900/7800, Snapdragon 8 Gen 1, Snapdragon 865/865+/870 5G Mobile Platforms, Snapdragon W5+ Gen 1 Wearable Platform, Snapdragon XR2 5G Platform, and various wireless connectivity chips (WCD, WCN, WSA series). The CVSS v3.1 base score is 7.3, indicating a high severity level with network attack vector, low attack complexity, no privileges required, and no user interaction needed. The impact includes potential confidentiality, integrity, and availability compromises due to memory corruption, which could be exploited remotely without authentication. Although no known exploits are currently reported in the wild, the vulnerability’s nature and broad product impact make it a significant risk. Qualcomm has not yet published patches for this vulnerability as of the provided data. Organizations relying on affected Snapdragon components in their devices or infrastructure should prioritize risk assessment and mitigation strategies.
Potential Impact
For European organizations, the impact of CVE-2025-27071 is substantial due to the widespread use of Qualcomm Snapdragon chipsets in mobile devices, IoT devices, wearables, and networking equipment. Exploitation could lead to remote code execution, data leakage, or denial of service, affecting confidentiality, integrity, and availability of critical systems. Enterprises with mobile workforces using affected smartphones or tablets may face data breaches or device compromise. Industrial sectors utilizing IoT devices with these chipsets for automation or communication could experience operational disruptions. The vulnerability’s exploitation without user interaction and privileges increases the risk of large-scale attacks, potentially impacting sensitive government, financial, healthcare, and critical infrastructure sectors across Europe. Additionally, the lack of patches heightens exposure until mitigations or updates are available.
Mitigation Recommendations
1. Immediate inventory and identification of devices and equipment using affected Qualcomm Snapdragon components across the organization’s environment. 2. Engage with device manufacturers and Qualcomm for timelines on patches or firmware updates and apply them promptly once available. 3. Implement network-level protections such as intrusion detection/prevention systems (IDS/IPS) tuned to detect anomalous traffic patterns or malformed packets targeting Powerline Communication Firmware interfaces. 4. Employ strict network segmentation to isolate vulnerable IoT and mobile devices from critical infrastructure and sensitive data stores. 5. Enforce endpoint security controls including application whitelisting, behavior monitoring, and anomaly detection to identify potential exploitation attempts. 6. Educate users about the risks and encourage minimizing exposure by avoiding untrusted networks or files that could trigger the vulnerability. 7. Monitor threat intelligence feeds for emerging exploit techniques or proof-of-concept code to adapt defenses proactively. 8. Consider deploying virtual patching or compensating controls at the network edge until official patches are released.
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Technical Details
- Data Version
- 5.1
- Assigner Short Name
- qualcomm
- Date Reserved
- 2025-02-18T09:19:46.888Z
- Cvss Version
- 3.1
- State
- PUBLISHED
Threat ID: 689308a3ad5a09ad00ef01f4
Added to database: 8/6/2025, 7:47:47 AM
Last enriched: 8/6/2025, 8:03:34 AM
Last updated: 9/4/2025, 10:23:07 PM
Views: 18
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CriticalActions
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