CVE-2023-33063: CWE-416 Use After Free in Qualcomm, Inc. Snapdragon
CVE-2023-33063 is a high-severity use-after-free vulnerability (CWE-416) affecting numerous Qualcomm Snapdragon platforms and related products. It involves memory corruption in DSP Services triggered during remote calls from the High-Level Operating System (HLOS) to the Digital Signal Processor (DSP). The vulnerability requires low privileges and no user interaction but local access, enabling potential attackers to execute arbitrary code or cause denial of service. This flaw impacts confidentiality, integrity, and availability of affected devices. While no known exploits are currently reported in the wild, the broad range of affected Snapdragon platforms, including mobile, IoT, automotive, and wearable devices, poses a significant risk. European organizations relying on Qualcomm Snapdragon-based infrastructure or devices should prioritize patching once updates are available. Mitigation involves applying vendor patches, restricting local access, and monitoring for anomalous DSP service behavior. Countries with high mobile and IoT adoption, such as Germany, France, UK, and the Nordics, are most likely to be affected due to market penetration and strategic technology use. The vulnerability’s CVSS score is 7. 8, reflecting its high severity given the potential for remote code execution and system compromise without user interaction.
AI Analysis
Technical Summary
CVE-2023-33063 is a use-after-free vulnerability classified under CWE-416 that affects a wide range of Qualcomm Snapdragon platforms and associated products. The issue arises from improper memory management in the DSP Services component, specifically during remote procedure calls from the High-Level Operating System (HLOS) to the Digital Signal Processor (DSP). This memory corruption flaw can be exploited by an attacker with low privileges and local access to the device, without requiring user interaction. Exploitation could lead to arbitrary code execution within the DSP context, potentially allowing attackers to escalate privileges, compromise system integrity, leak sensitive information, or cause denial of service by crashing the DSP service or the entire device. The vulnerability affects a vast array of Qualcomm products spanning mobile platforms (including Snapdragon 8 Gen series, 7 series, 6 series, and others), IoT modems, automotive platforms, wearable devices, and connectivity modules such as FastConnect and WCN series. The breadth of affected products indicates a systemic issue in the DSP Services implementation across Qualcomm’s product lines. The CVSS v3.1 score of 7.8 (AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) highlights that the attack vector is local, requires low privileges, no user interaction, and impacts confidentiality, integrity, and availability at a high level. No public patches or known exploits are currently reported, but the vulnerability’s presence in critical communication and processing components makes it a significant threat. The complexity of exploitation is moderate due to the need for local access and understanding of DSP internals, but the potential impact on device security and stability is severe.
Potential Impact
For European organizations, the impact of CVE-2023-33063 is substantial due to the widespread use of Qualcomm Snapdragon platforms in mobile devices, IoT infrastructure, automotive systems, and enterprise communication equipment. Confidentiality risks include potential leakage of sensitive corporate or personal data processed by affected devices. Integrity risks involve unauthorized code execution that could alter device behavior or inject malicious payloads, undermining trust in critical systems. Availability could be compromised by denial-of-service conditions caused by crashing DSP services, potentially disrupting communications or operational technology systems. Industries such as telecommunications, automotive manufacturing, smart home and IoT deployments, and enterprise mobile device management are particularly vulnerable. The vulnerability could be leveraged for lateral movement within networks or persistent footholds in devices. Given the integration of Snapdragon components in many consumer and industrial devices, the risk extends beyond traditional IT to operational technology environments. The lack of known exploits currently provides a window for proactive mitigation, but the high severity necessitates urgent attention to patch management and access controls.
Mitigation Recommendations
1. Monitor Qualcomm and device vendors for official patches and apply them promptly once available to address the use-after-free flaw in DSP Services. 2. Restrict local access to devices running affected Snapdragon platforms by enforcing strong physical security and limiting administrative privileges. 3. Implement strict application whitelisting and endpoint detection to identify anomalous behavior related to DSP service interactions. 4. Employ network segmentation to isolate critical IoT and mobile devices, reducing the risk of lateral movement if a device is compromised. 5. Conduct regular firmware and software integrity checks on devices to detect unauthorized modifications. 6. For organizations deploying custom or embedded systems with Qualcomm chips, review and harden the DSP communication interfaces and audit inter-process communication mechanisms. 7. Educate security teams about the specific nature of DSP-related vulnerabilities to improve incident response readiness. 8. Utilize mobile device management (MDM) solutions to enforce security policies and monitor device health continuously. 9. Collaborate with suppliers and partners to ensure supply chain security and timely vulnerability remediation. 10. Consider deploying runtime protection technologies that can detect and prevent exploitation attempts targeting memory corruption vulnerabilities.
Affected Countries
Germany, France, United Kingdom, Italy, Spain, Netherlands, Sweden, Finland, Norway, Denmark
CVE-2023-33063: CWE-416 Use After Free in Qualcomm, Inc. Snapdragon
Description
CVE-2023-33063 is a high-severity use-after-free vulnerability (CWE-416) affecting numerous Qualcomm Snapdragon platforms and related products. It involves memory corruption in DSP Services triggered during remote calls from the High-Level Operating System (HLOS) to the Digital Signal Processor (DSP). The vulnerability requires low privileges and no user interaction but local access, enabling potential attackers to execute arbitrary code or cause denial of service. This flaw impacts confidentiality, integrity, and availability of affected devices. While no known exploits are currently reported in the wild, the broad range of affected Snapdragon platforms, including mobile, IoT, automotive, and wearable devices, poses a significant risk. European organizations relying on Qualcomm Snapdragon-based infrastructure or devices should prioritize patching once updates are available. Mitigation involves applying vendor patches, restricting local access, and monitoring for anomalous DSP service behavior. Countries with high mobile and IoT adoption, such as Germany, France, UK, and the Nordics, are most likely to be affected due to market penetration and strategic technology use. The vulnerability’s CVSS score is 7. 8, reflecting its high severity given the potential for remote code execution and system compromise without user interaction.
AI-Powered Analysis
Technical Analysis
CVE-2023-33063 is a use-after-free vulnerability classified under CWE-416 that affects a wide range of Qualcomm Snapdragon platforms and associated products. The issue arises from improper memory management in the DSP Services component, specifically during remote procedure calls from the High-Level Operating System (HLOS) to the Digital Signal Processor (DSP). This memory corruption flaw can be exploited by an attacker with low privileges and local access to the device, without requiring user interaction. Exploitation could lead to arbitrary code execution within the DSP context, potentially allowing attackers to escalate privileges, compromise system integrity, leak sensitive information, or cause denial of service by crashing the DSP service or the entire device. The vulnerability affects a vast array of Qualcomm products spanning mobile platforms (including Snapdragon 8 Gen series, 7 series, 6 series, and others), IoT modems, automotive platforms, wearable devices, and connectivity modules such as FastConnect and WCN series. The breadth of affected products indicates a systemic issue in the DSP Services implementation across Qualcomm’s product lines. The CVSS v3.1 score of 7.8 (AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) highlights that the attack vector is local, requires low privileges, no user interaction, and impacts confidentiality, integrity, and availability at a high level. No public patches or known exploits are currently reported, but the vulnerability’s presence in critical communication and processing components makes it a significant threat. The complexity of exploitation is moderate due to the need for local access and understanding of DSP internals, but the potential impact on device security and stability is severe.
Potential Impact
For European organizations, the impact of CVE-2023-33063 is substantial due to the widespread use of Qualcomm Snapdragon platforms in mobile devices, IoT infrastructure, automotive systems, and enterprise communication equipment. Confidentiality risks include potential leakage of sensitive corporate or personal data processed by affected devices. Integrity risks involve unauthorized code execution that could alter device behavior or inject malicious payloads, undermining trust in critical systems. Availability could be compromised by denial-of-service conditions caused by crashing DSP services, potentially disrupting communications or operational technology systems. Industries such as telecommunications, automotive manufacturing, smart home and IoT deployments, and enterprise mobile device management are particularly vulnerable. The vulnerability could be leveraged for lateral movement within networks or persistent footholds in devices. Given the integration of Snapdragon components in many consumer and industrial devices, the risk extends beyond traditional IT to operational technology environments. The lack of known exploits currently provides a window for proactive mitigation, but the high severity necessitates urgent attention to patch management and access controls.
Mitigation Recommendations
1. Monitor Qualcomm and device vendors for official patches and apply them promptly once available to address the use-after-free flaw in DSP Services. 2. Restrict local access to devices running affected Snapdragon platforms by enforcing strong physical security and limiting administrative privileges. 3. Implement strict application whitelisting and endpoint detection to identify anomalous behavior related to DSP service interactions. 4. Employ network segmentation to isolate critical IoT and mobile devices, reducing the risk of lateral movement if a device is compromised. 5. Conduct regular firmware and software integrity checks on devices to detect unauthorized modifications. 6. For organizations deploying custom or embedded systems with Qualcomm chips, review and harden the DSP communication interfaces and audit inter-process communication mechanisms. 7. Educate security teams about the specific nature of DSP-related vulnerabilities to improve incident response readiness. 8. Utilize mobile device management (MDM) solutions to enforce security policies and monitor device health continuously. 9. Collaborate with suppliers and partners to ensure supply chain security and timely vulnerability remediation. 10. Consider deploying runtime protection technologies that can detect and prevent exploitation attempts targeting memory corruption vulnerabilities.
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Technical Details
- Data Version
- 5.1
- Assigner Short Name
- qualcomm
- Date Reserved
- 2023-05-17T09:28:53.128Z
- Cvss Version
- 3.1
- State
- PUBLISHED
Threat ID: 68f7d9a9247d717aace21ecd
Added to database: 10/21/2025, 7:06:17 PM
Last enriched: 10/28/2025, 11:49:04 PM
Last updated: 10/30/2025, 3:06:17 AM
Views: 4
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